DIRECT-TO-CHIP · CUSTOM-ENGINEERED · DRAWING-TO-ORDER
Six core liquid-cooling component families, each built to your CAD and thermal requirements
Direct-to-chip cold plates with micro-channel and brazed fin structures for high-heat-flux GPUs and CPUs.
Supply/return distribution manifolds with branching, mounting interfaces and sensor ports to your layout.
Flat-face, dripless quick-disconnect couplings for leak-free service and loop maintenance.
Brazed-plate and tube-in-shell heat exchangers for coolant distribution units (CDU) and primary loops.
Stainless and copper liquid lines, elbows, adapters and hose fittings rated for continuous coolant service.
Brazing, welding, surface treatment and 100% pressure / helium leak testing to your specification.
From your drawing to volume production in four transparent steps — online, no phone tag
Attach your CAD/PDF and thermal specs through the online form.
Our engineers review feasibility and send a quote within 24 working hours.
We produce samples for flow, pressure and leak validation before mass production.
Series supply with export documentation, shipped to 20+ countries worldwide.
The more detail you send, the faster and more accurate our engineering reply
| Item | Details to Provide |
|---|---|
| Drawing / CAD | STEP, DWG or PDF with dimensions, tolerances and material call-outs |
| Coolant Fluid | Water, water-glycol or dielectric fluid; expected conductivity |
| Thermal Requirements | Heat load per chip, target inlet/outlet temperature and ΔT |
| Hydraulic Parameters | Required flow rate, allowable pressure drop and operating pressure |
| Connections | Quick-disconnect type, thread / flange and port size |
| Material & Finish | Aluminum, copper, stainless; surface treatment and sealing requirement |
| Quantity & Market | Estimated annual volume and destination country |
Built for the highest-density thermal challenges of modern computing
Direct-to-chip cooling for power-hungry AI accelerators and training nodes.
Reliable liquid loops for high-performance compute clusters.
Rack-level and row-level cooling components for modern data-center builds.
Cooling plates for EV power electronics, energy storage and industrial converters.
Send us your drawings — our engineers reply online within 24 working hours. No phone tag, no generic catalogues.